SilTest Semiconductors
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Engineering services

Engineers who work alongside your team

The same people who build our AI tools deliver hands-on semiconductor engineering, from new product introduction to volume production. Turnkey and fixed-price, so your schedule and budget stay predictable.

Tell us about your projectSee the services
Design for Test→Hardware Design→Test Engineering→Characterization and Qual→Yield Management
Turnkey and fixed-price

Predictable by design

Scope, schedule, and budget defined up front, so there are no surprises later.

Platform-independent

Cross-ATE experience

Hands-on across the major tester families, at wafer, final, and system-level test.

Tool-accelerated

Our own AI tools

The same tools we license, VISTAR and YieldOptiX, speed up the work we do for you.

Our engineers bring decades of hands-on experience from Tier-1 semiconductor companies, and we are trusted by leading automotive and industrial manufacturers across Europe.

Where we fit

One partner across your product flow

The five services below map onto the stages your product already moves through.

DesignRTL to tapeout
Bring-up and NPIfirst silicon
Qualificationrelease to production
Volume productionramp and sustain
Design for Test
Hardware DesignTest Engineering
Packaging and Qualification
Yield Management

Take one service, or hand us the whole flow.

Service 01

Design for Test

Build testability in early, so quality and cost are right from the start.

What we do
  • Scan architecture and insertion: full and partial scan, compression, at-speed scan, chain balancing
  • Built-in self-test: logic, memory, and analog BIST
  • Boundary scan: IEEE 1149.x, board-level test hooks, and debug chains
  • Test mode and structure definition: PLL and DLL access, loopbacks, analog monitors
  • ATPG and coverage analysis, with pattern optimization
  • DFT sign-off: rule-based verification and a final DFT report
What you get
  • High fault coverage with fewer patterns, so less test cost and time
  • On-chip test that speeds bring-up and improves coverage
  • Simpler board-level debug and in-field diagnostics
  • A clean path to tapeout and test program development
We also define test strategy, coverage goals, and the test flow with you, from wafer to system-level test.
Service 02

Hardware Design

Boards for wafer and final test, qualification, and burn-in.

What we do
  • ATE test interface boards: load boards and probe cards
  • MLO and MLC substrate design
  • Signal and power integrity simulation
  • Library development and maintenance
  • CAM validation and editing
Board types and expertise
  • Load boards, probe interface boards, probe cards (vertical and cantilever), daughter cards, and HTOL and burn-in qualification boards
  • High-speed and mixed-signal work: DDR, USB, PCIe, SATA, HDMI, MIPI, 28 and 56 GBps SerDes, and 60 GHz in substrate
Advantest V93K, T2000Teradyne UltraFlex, J750, ETSChroma
Service 03

Test Engineering

From new product introduction to scalable production, with tools that cut the manual work.

What we do
  • NPI test development: test strategy, pattern generation, ATE program development
  • Test hardware design: load board and probe card design, electrical and mechanical validation
  • Debug and characterization: first silicon debug, limit setup, corner characterization
  • Sustaining engineering: multisite enablement, yield and test time improvement
  • Failure analysis and compliance support through our partner network
What you get
  • Faster bring-up, improved DPPM, and predictable schedules
  • Accelerated time to yield and lower retest rates
  • Cost reduction and higher throughput
VISTAR reduces test time and optimizes, converts, and debugs test programs with AI. See VISTAR
Advantest V93K, T2000Teradyne UltraFlex, J750, ETSLTXChromaNI
Platforms

Testers we support today

Cross-ATE and platform-independent, at wafer, final, and system-level test.

Advantest V93000
Advantest V93000
Advantest T2000
Advantest T2000
Teradyne UltraFLEXplus
Teradyne UltraFLEXplus
Teradyne J750
Teradyne J750
Teradyne ETS-800
Teradyne ETS-800
Teradyne ETS-88
Teradyne ETS-88
Service 04

Packaging and Qualification

From tapeout to production, the steps that get your product qualified and released.

What we do
  • Packaging: assemble your MPW or SPW wafer into samples in the package you need
  • Engineering samples: generate early samples on bench or ATE
  • Enable qualification: a high-coverage test program for reliability testing
  • Run qualification: all qual steps, readouts, and reports through our European partners
  • Characterization: standard or matrix lot across operating conditions, with reports
  • Release to production: a cost-optimized test solution for high volume at your chosen OSAT
What you get
  • A clear path from tapeout to production, ready for PPAP
  • Qualification and reliability handled end to end
  • A production-ready, cost-optimized test solution
The work continues after release: we stay on for ongoing yield management and production support.
Service 05

Yield Management

Data-driven NPI and yield, with AI doing the analysis.

What we do
  • NPI support: yield and quality target setting, process corner definition, characterization
  • Data analysis: failure analysis, yield loss diagnostics, ATE-to-bench correlation
  • Qualification and release: qual planning, documentation, and release support
  • Sustaining support: drift analysis, bin-flip, Gage R&R, and production health monitoring
What you get
  • High correlation with the fab, and a smooth qual and PPAP ramp
  • Rapid root cause, and informed design and test improvements
  • Automotive-grade traceability and first-pass production readiness
  • Continuous yield and quality improvement
YieldOptiX and VISTAR drive the analysis: root cause, outlier detection, and retest prediction. See YieldOptiX

Tell us about your project

Turnkey and fixed-price, from a single test program to a full path to production.

Talk to usSee the tools